CMP, Often called thermal oxidation polishing, utilizes MP together with chemicals to improve the MRR and improve area high-quality [20]. Determine 2 illustrates the schematic of a typical CMP process [21]. The SiC wafer, which can be preset on the provider, as well as the polishing pad shift relative to https://www.quora.com/profile/Trevor-Flatcher-2/Key-Applications-of-Silicon-Carbide-in-the-Aerospace-Industry-Silicon-Carbide-SiC-has-emerged-as-a-crucial-material-i